Hysol® EA 9658™ Epoxy Film Adhesive

High Strength and Durable Nacelle Film Adhesive

 

A state-of-the-art, high temperature and durable, epoxy-based film adhesive, Hysol® EA 9658™ has been developed. This adhesive is a 177°C (350°F) cure system and aimed at the highly demanding aerospace nacelle bonding applications. Hysol® EA 9658™ is the next generation nacelle film adhesive when compared to industry standard since it possesses unusually high toughness and peel strength while maintaining superior high temperature properties. It is suitable for demanding applications where continuous exposure (6,000+ hours) to temperatures up to 177°C is required. A unique advantage of this new technology is the controlled flow, which enables it to perform well in reticulated sound suppression nacelle structures.

 

Reticulation Process Hysol® EA 9658™ is applied using the process of reticulation. The adhesive is applied to one side and then heat is applied to the other side. The adhesive then heats up and starts to bubble. The adhesive then pops and lands only on the metal area.The holes are not covered. Play the video to a short video on the reticulation process.

 

 

Reticulation Process

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